8 de mayo de 2014 / 11:45 / en 4 años

New Issue-Sun Hung Kai Properties prices S$320 mln 2021 bond

May 8 (Reuters) -Following are terms and conditions

of a bond priced on Thursday.

Borrower Sun Hung Kai Properties (Capital Market) Limited

Guarantor Sun Hung Kai Properties Limited

Issue Amount S$320 million

Maturity Date May 20, 2021

Coupon 3.25 pct

Issue price Par

Reoffer price Par

Reoffer Yield 3.25 pct

Payment Date May 20, 2014

Lead Manager(s) UOB

Ratings A (S&P)

Denoms (K) 250

Governing Law English

Notes Launched under issuer’s DIP programme

Security details and RIC, when available, will be


Customers can right-click on the code for

performance analysis of this new issue

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