22 de mayo de 2014 / 13:53 / hace 3 años

New Issue-Nan Fung Treasury prices $200 mln 2024 bond

May 22 (Reuters) -Following are terms and conditions

of a bond priced on Thursday.

Borrower Nan Fung Treasury

Guarantor Nan Fung International Holdings Limited

Issue Amount $200 million

Maturity Date May 29, 2024

Coupon 4.875 pct

Issue price 99.5

Reoffer price 99.5

Yield 4.939 pct

Spread 240 basis points

Underlying govt bond Over the UST

Payment Date May 29, 2014

Lead Manager(s) ABC, BAML, Credit Suisse, HSBC and Standard Chartered

Ratings Baa3 (Moody‘s), BBB (S&P),

BBB (Fitch)

Listing SGX

Denoms (K) 200-1

Governing Law English

Notes Launched under issuer’s MTN programme

Security details and RIC, when available, will be


Customers can right-click on the code for

performance analysis of this new issue

For ratings information, double click on

For all bonds data, double click on

For Top international bonds news

For news about this issuer, double click on the issuer RIC,

where assigned, and hit the newskey (F9 on Reuters terminals)

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